Unit of competency Outline
Date retreived
23/07/2026 7:02 AM AWST
23/07/2026 7:02 AM AWST
Whilst all efforts are made to provide accurate and timely information from the relevant source/documentation, please be aware that the information supplied may not be the most current version. The accuracy of the detail has not been confirmed by the Department and therefore should not be relied upon without first confirming the contents.
Modify and repair aircraft component multi-layer printed circuit boards
Modify and repair aircraft component multi-layer printed circuit boards
Unit of competency
National Code
MEAAVI0040
MEAAVI0040
State Code
OEG95
OEG95
TGA Status
Current
Current
DTWD Status
Approved
Approved
State Implementation and Classification
Approved Date
28/03/2023
Field of Education
031313 - Electrical Fitting, Electrical Mechanics
Original Release Date
28/03/2023
Nominal Hours
16
Description
This unit describes the skills and knowledge required to apply hand skills (including those required to gain access to inner layers and repair outer layers after track repair, and high reliability hand soldering), and knowledge of standard practices and techniques in the repair of multi-layer printed circuit boards from aircraft avionic components that are repaired in aviation workshops during scheduled or unscheduled maintenance. Work may be performed individually or as part of a team.The unit is used in workplaces that operate under the airworthiness regulatory systems of the Civil Aviation Safety Authority (CASA) and the Defence Aviation Safety Authority (DASA).Any other relevant legislation, industry standards and codes of practice within Australia must be applied.
Notes
Elements and Performance Criteria
1. Inspect multi-layer printed circuit boards and associated components
- 1.1 Interpret required maintenance documentation, including component defect reports and match parts and serial numbers
- 1.2 Prepare work area and circuit board assemblies in accordance with standard enterprise procedures to allow for effective detailed inspection of all substrate, circuit tracks, edge connectors and attached components, taking into account any static discharge procedures
- 1.3 Visually or physically inspect circuit board assemblies for physical integrity of substrate, circuit tracks, edge connectors and attached components in accordance with maintenance documentation while observing all relevant work health and safety (WHS) requirements
- 1.4 Establish modification status to assist in determining repair requirements
- 1.5 Identify and report defects in accordance with standard enterprise procedures
2. Test or adjust multi-layer printed circuit boards and associated components
- 2.1 Prepare and connect circuit board assemblies to the appropriate test facility in accordance with approved procedures, or prepare and connect circuit board assemblies in situ to allow required test procedures to be performed
- 2.2 Perform functional testing on circuit board assemblies for evidence of serviceability or malfunction in accordance with normal trade practice and maintenance documentation
- 2.3 Electronically or physically adjust or align circuit board assemblies, attached hardware and electronic components in accordance with maintenance manuals or other prescribed procedures
3. Troubleshoot multi-layer printed circuit cards and associated components
- 3.1 Use required maintenance documentation, physical inspection and test results to assist in fault determination
- 3.2 Troubleshoot using maintenance manual fault diagnosis guides, logical processes and test equipment
- 3.3 Locate component faults and identify and record causes of faults in required maintenance documentation
- 3.4 Determine required for rectification of faults
4. Dismantle multi-layer printed circuit cards and associated components
- 4.1 Remove conformal or protective coatings from the circuit board assembly to the extent required to effect necessary repairs and in accordance with maintenance manuals, industry or enterprise standards as applicable
- 4.2 Observe WHS requirements at all times during maintenance procedures and use required material safety data sheets (MSDSs) and personal protective equipment (PPE)
- 4.3 Dismantle circuit board assembly to the extent necessary to allow repair of all identified faults
- 4.4 Tag and dispatch parts for processing in accordance with specified procedures
- 4.5 Package and store parts for retention and refitment in accordance with standard enterprise procedures to avoid physical and electrostatic damage
- 4.6 Pack and process parts for disposal in accordance with statutory requirements pertaining to dangerous goods
5. Assemble multi-layer printed circuit boards and associated components
- 5.1 Collect parts removed for access and replacement parts, ensuring appropriate modification status, component tolerances and assembly configuration is maintained
- 5.2 Replace conformal or protective coatings to the required standard of the equipment manufacturer or industry standard
- 5.3 Ensure rework techniques are in accordance with industry approved procedures, and observe required WHS precautions, including use of MSDS and PPE
- 5.4 Assemble printed circuit board and associated components in accordance with maintenance manuals, and ensure all electrical joints meet the required standard of the equipment manufacturer or industry standard
- 5.5 Rework circuit substrate material, circuit tracks, edge connectors and through-hole eyelets as required to restore printed circuit board to a serviceable condition
No information
No information
Replaces
| State Code | National Code | Title | Type |
|---|---|---|---|
| AUE93 | MEA263 | Modify/repair aircraft component multi-layer printed circuit boards | Unit of competency |
| State Code | National Code | Title | Type |
|---|---|---|---|
| BDW5 | MEA40618 | Certificate IV in Aeroskills (Avionics) | Qualification |